Why This Process Matters
{ Metalized Film Production Line }
Metalized films are the invisible heroes in food packaging, electronics, and renewable energy. At CloudFilm, we’ve engineered over 500M㎡ of precision-coated films. The secret? A meticulously controlled manufacturing process that determines:
✅ Oxygen barrier performance (as low as 0.05 cc/m²/day)
✅ Metallic luster & reflectivity (up to 98%)
✅ Adhesion strength (>3.5 N/15mm)
The 5-Step Manufacturing Workflow
Step 1: Substrate Preparation
The Foundation of Quality
-
Material Selection: PET (12-250μm), BOPP (15-50μm), CPP (20-100μm)
-
Corona Treatment: Increases surface energy from 30 dynes/cm to 50+ dynes/cm
-
Primer Coating: Applied at 0.5-2 g/m² for enhanced adhesion
{ Surface Activation Technology }
Step 2: Vacuum Metallization (The Core Process)
Technology Comparison:
| Parameter | Thermal Evaporation | Sputtering |
|---|---|---|
| Deposition Rate | 100-500 nm/sec | 5-50 nm/sec |
| Film Quality | Good | Excellent |
| Cost Efficiency | ★★★★★ | ★★★☆☆ |
| Best For | Food packaging | Electronics |
Critical Control Points:
-
Vacuum level: 10⁻⁴ to 10⁻⁶ mbar
-
Web speed: 5-15 m/s
-
Aluminum thickness: 20-100 nm
*CloudFilm Insight: Our E-beam evaporation system achieves ±3% thickness uniformity*
Step 3: Protective Coating
Prevents oxidation and scratching:
-
Acrylic coatings for general use
-
UV-cured coatings for electronics
-
Application weight: 0.8-1.5 g/m²
Step 4: Quality Assurance
Real-time monitoring systems:
-
Optical density sensors (0-5 OD)
-
On-line OTR testing
-
CCD camera defect detection
Step 5: Winding & Slitting
Tension control at 10-15 kg/cm² prevents creasing
Solving Real Production Challenges
Top 5 Manufacturing Issues & Solutions:
| Problem | Root Cause | CloudFilm Solution |
|---|---|---|
| Poor adhesion | Inadequate corona treatment | Increase power to 15+ kW/m² |
| Pinholes | Substrate contamination | Install Class 1000 clean room |
| Uneven coating | Wobbling web | Magnetic guiding system upgrade |
| Oxidation spots | Moisture ingress | Triple-barrier packaging |
| Low production speed | Pumping system limitation | Cryogenic pumping technology |
Application-Specific Process Tuning
How We Optimize for Different Industries:
Food Packaging Films:
-
Focus: Oxygen barrier & cost efficiency
-
Process: High-speed evaporation (12 m/s)
-
Aluminum thickness: 40 nm
Capacitor Films:
-
Focus: Uniformity & conductivity
-
Process: Sputtering with plasma pre-treatment
-
Tolerance: ±1.5% thickness variation
Decorative Films:
-
Focus: Optical brilliance
-
Process: Dual-side metallization
-
Reflectivity: >95%
CloudFilm’s Technological Edge
Our innovations:
-
Extends shelf-life by 40%
-
Real-time 3D thickness mapping
-
Reduces aluminum waste by 30%
“By controlling plasma density within 10¹⁰–10¹¹ cm⁻³, we achieve adhesion forces 2X industry standards.”
— Dr. Dennis, CloudFilm CTO
Future Trends (2025-2030)
-
AI-driven predictive maintenance
-
ZnO/Ag alloy coatings for antimicrobial films
-
Sustainable metallization with recycled aluminum
